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disposing of components
SEMI E80-0423 (technical revision)
previously published November 2015
fault detection (FD)
as when pulled down onto an ideally clean flat chuck
E14200 - SEMI E142 - Specification for Substrate Mapping Revision:SEMI E142-0705 - Superseded disposing of components1 Purpose 1. 1 This Specification defines the data items that are required to report, store, and transmit map data for substrates such as wafers, frames, strips, and trays. 2 Scope 2. 1 This version of the Specification applies to the substrate types: wafers, frames, strips, and trays. 2. 2 This Specification addresses assembly and packaging including the testing of semiconductor devices. Subordinate Standards (included) SEMI E142. 1 Specification for
